Multilayers

Technologies :

• Through holes
• Buried vias
• Sequential blinded vias
• Controlled impedance

Specificities :

• Internal or External Heat sink
• Via Plug
• Mother board with Press Fit
• Rigid-Flex technology (mulilayers)

Capabilities :

• Trace minimal width : 85 µm / 215 mils
• Board Thickness min 0.4 mm to 6 mm maximum

• Raw Material :
  High Tg Multifonctional Epoxy Laminate & Prepreg, low CTE
  FR4 « Dicy Cured » 150°c - 175°c
  FR4 148°c « Dicy Cured Halogen free »
  FR4 HTG 150°c , 180°c - Low CTE
  BT Resin - Polyimide - Cyanate Ester
  Hyper Frequency : Glass Teflon, Ceramic Material
• Panelisation / Scoring / Soldermask / Dry Film
• Routing / Axe Z control / Special routing / Plated edge
• Finishing : SnPb HAL / ENIG / Chemical Tin...