Multilayers

MultilayersMultilayers

Technologies :

  • Through holes
  • Buried vias
  • Sequential blinded vias
  • Controlled impedance

Specificities :

  • Internal or External Heat sink
  • Via Plug
  • Mother board with Press Fit
  • Rigid-Flex technology (mulilayers)

Capabilities :

  • Trace minimal width : 85 µm / 215 mils
  • Board Thickness min 0.4 mm to 6 mm maximum

 

  • Raw Material :
    High Tg Multifonctional Epoxy Laminate & Prepreg, low CTE
    FR4 « Dicy Cured » 150°c - 175°c
    FR4 148°c « Dicy Cured Halogen free »
    FR4 HTG 150°c , 180°c - Low CTE
    BT Resin - Polyimide - Cyanate Ester
    Hyper Frequency : Glass Teflon, Ceramic Material
  • Panelisation / Scoring / Soldermask / Dry Film
  • Routing / Axe Z control / Special routing / Plated edge
  • Finishing : SnPb HAL / ENIG / Chemical Tin...

+33 (0) 4 76 31 71 55


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Accueil - Techci Rhône Alpes