 Laser Microvias
Microvias laser Technology : 100 µm - 1, 2 levels
Opposit Vias Technology
 |
| |
|
PRODUCTION |
LIMITED |
| a & b |
Pad Via |
350 µm |
350 µm |
| c - d - e - f |
Width / Space internal / external conductor |
100 µm |
75 µm |
| g
& k |
Crossing pad via diameter |
650 µm |
550 µm |
| |
Burried pad via diameter |
550 µm |
500 µm |
| h & j |
Crossing and burried via drilling diameter |
350 µm |
300 µm |
| i |
Base copper thickness recommended |
5 to 17.5 µm |
5 µm |
| z |
1 prepreg type 106 |
50 to 60 µm |
50 to 60 µm |
| z |
2 prepreg 106 |
75 to 90 µm |
75 to 90 µm |
|
 |
| |
PRODUCTION |
LIMITED |
| Soldermask track minimum width |
100 µm |
100 µm |
| Soldermask figure accuracy |
+/ -50 |
+/ -40 |
| Number of microvias level by face |
1 |
2 |
| Aspect ratio for crossing & burried
drilling holes
(max) |
7 |
8 |
|
|
|
