Laser MicroviasLaser Microvias

Microvias laser Technology : 100 µm - 1, 2 levels
Opposit Vias Technology


Laser Microvias

Laser Microvias
    PRODUCTION LIMITED
a & b Pad Via 350 µm 350 µm
c - d - e - f Width / Space internal / external conductor 100 µm 75 µm
g & k Crossing pad via diameter 650 µm 550 µm
  Burried pad via diameter 550 µm 500 µm
h & j Crossing and burried via drilling diameter 350 µm 300 µm
i Base copper thickness recommended 5 to 17.5 µm 5 µm
z 1 prepreg type 106 50 to 60 µm 50 to 60 µm
z 2 prepreg 106 75 to 90 µm 75 to 90 µm
Laser Microvias
  PRODUCTION LIMITED
Soldermask track minimum width 100 µm 100 µm
Soldermask figure accuracy +/ -50 +/ -40
Number of microvias level by face 1 2
Aspect ratio for crossing & burried drilling holes (max) 7 8

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